| 摘要 |
A device for maintaining the separation and position of spliced wires within a mold is provided. The device is characterized by multiple pointed portions which extend radially outward to a tip. The portions between the tips are radially depressed, with holes placed near the radially innermost point of the outer surface of the device. The holes are incomplete due to notches on the radially outermost portion of the holes which allow wires to be pressed into the holes in a radially inward direction. The device, with wires mounted therein, may be placed into an injection mold and maintains the separation of the exposed conductors until the over-molding process is complete. The device also prevents the wires from touching the edge of the mold during the injection process thereby minimizing any show-through defects in the finished product.
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