| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device formed by connecting a ceramic substrate to one face of a die pad through a bonding agent which prevents a scattered substance generated from the bonding agent when the bonding agent is heated and hardened from being attached to the die pad and a ceramic substance without providing a limit in a material of the bonding agent, or cleaning after bonding. <P>SOLUTION: A barrier layer 40 dividing a bonding agent 30 from the outside of the bonding agent 30 is formed surrounding the bonding agent 30 between a die pad 10 and a ceramic substrate 20, and the barrier layer 40 prevents the leakage of the scattered substance upon heating to the outside of the bonding agent 30. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
