| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package capable of expanding usability of an optical device while keeping low-cost and high reliability. <P>SOLUTION: The package A has the optical device 10 mounted in a flip-chip state over a mother substrate 1. First and second interconnect pads 5 and 6 are provided on an upper surface of the mother substrate 1, and an opening 1a is formed in the mother substrate 1. On a principal surface side of the optical device 10, a p-type electrode 15 and an n-type electrode 16 are provided. Between the optical device 10 and mother substrate 1, an ACF 30 is interposed which has chain metallic particles 31 dispersed in light-transmissive resin. The p-type electrode 15 and n-type electrode 16, and the first and second interconnect pads 5 and 6 are electrically connected to each other by the chain metallic particles 31 in the ACF 30. The ACF 30 having the chain metallic particles dispersed functions as a path for light in addition to a chip bonding function and an electric connection function. <P>COPYRIGHT: (C)2010,JPO&INPIT |
