发明名称 |
EPITAXIAL FILM ASSEMBLY SYSTEM & METHOD |
摘要 |
<p>An epitaxy-level packaging grows an epitaxial film and transfers it to an assembly substrate. The film growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.</p> |
申请公布号 |
WO2010062659(A1) |
申请公布日期 |
2010.06.03 |
申请号 |
WO2009US62415 |
申请日期 |
2009.10.28 |
申请人 |
ATHENAEUM, LLC;PAN, ERIC, TING-SHAN |
发明人 |
PAN, ERIC, TING-SHAN |
分类号 |
H01L27/06 |
主分类号 |
H01L27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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