发明名称 EPITAXIAL FILM ASSEMBLY SYSTEM & METHOD
摘要 <p>An epitaxy-level packaging grows an epitaxial film and transfers it to an assembly substrate. The film growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.</p>
申请公布号 WO2010062659(A1) 申请公布日期 2010.06.03
申请号 WO2009US62415 申请日期 2009.10.28
申请人 ATHENAEUM, LLC;PAN, ERIC, TING-SHAN 发明人 PAN, ERIC, TING-SHAN
分类号 H01L27/06 主分类号 H01L27/06
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