发明名称 |
Method of forming ring electrode |
摘要 |
The present invention in one embodiment provides a method of forming an electrode that includes the steps of providing at least one metal stud in a layer of an interlevel dielectric material; forming a pillar of a first dielectric material atop the at least one metal stud; depositing an electrically conductive material atop the layer of the interlevel dielectric material and an exterior surface of the pillar, wherein a portion of the electrically conductive material is in electrical communication with the at least one metal stud; forming a layer of a second dielectric material atop the electrically conductive material and the substrate; and planarizing the layer of the second dielectric material to expose an upper surface of the electrically conductive material.
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申请公布号 |
US7709325(B2) |
申请公布日期 |
2010.05.04 |
申请号 |
US20080043228 |
申请日期 |
2008.03.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JOSEPH ERIC A.;LAM CHUNG H.;SCHROTT ALEJANDRO G. |
分类号 |
H01L21/8234;H01L21/336;H01L21/44;H01L21/8244 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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