发明名称 Method of forming ring electrode
摘要 The present invention in one embodiment provides a method of forming an electrode that includes the steps of providing at least one metal stud in a layer of an interlevel dielectric material; forming a pillar of a first dielectric material atop the at least one metal stud; depositing an electrically conductive material atop the layer of the interlevel dielectric material and an exterior surface of the pillar, wherein a portion of the electrically conductive material is in electrical communication with the at least one metal stud; forming a layer of a second dielectric material atop the electrically conductive material and the substrate; and planarizing the layer of the second dielectric material to expose an upper surface of the electrically conductive material.
申请公布号 US7709325(B2) 申请公布日期 2010.05.04
申请号 US20080043228 申请日期 2008.03.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 JOSEPH ERIC A.;LAM CHUNG H.;SCHROTT ALEJANDRO G.
分类号 H01L21/8234;H01L21/336;H01L21/44;H01L21/8244 主分类号 H01L21/8234
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