| 摘要 |
<P>PROBLEM TO BE SOLVED: To solder a heat radiation member in a normal soldering process, to provide a method for manufacturing a power circuit wiring structure using the heat radiation member, and to change the size, shape and kind, etc., of the heat radiation member. Ž<P>SOLUTION: In the method of manufacturing the power circuit wiring structure provided with the heat radiation member 7 for radiating heat generated in a copper foil pattern 2 on a printed circuit board 3, the heat radiation member 7 is divided into a main heat radiation member 1 and a main heat radiation member attaching base member 4, a fitting part 1a for fitting the main heat radiation member attaching base member 4 is formed on the main heat radiation member 1, the main heat radiation member attaching base member 4 is bonded to the copper foil pattern 2 by soldering, and by fitting the soldered main heat radiation member attaching base member 4 to the fitting part 1a of the main heat radiation member 1, the main heat radiation member 1 is thermally coupled to the copper foil pattern 2 through the main heat radiation member attaching base member 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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