| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a hybrid circuit device which has individual active/passive elements and is appropriate for size/thickness reduction in three-dimensional mounting and improving the reliability of connections between interconnects on both surfaces, a manufacturing method, and a hybrid circuit laminate. <P>SOLUTION: The hybrid circuit device includes the active element 1 and the individual passive element 30. The active element 1 includes a semiconductor chip 2 which is formed by dicing a semiconductor wafer into an individual piece of chip 2 and includes a wiring layer and an element electrode 3 for an element region formed on one surface of the semiconductor chip 2, a first insulating film 4 having a contact hole 5 for the element electrode on one surface of the semiconductor chip 2, a second insulating film 6 on the other surface of the chip 2, a first rewiring layer 7 which is connected to the element electrode and is formed together with a pad 8 on the surface of the first insulating film, a second rewiring layer 9 formed on the surface of the second insulating film, and an inter-layer wiring layer formed on a side face along a dicing line of the chip 2 to connect the first rewiring layer and the second rewiring layer. The individual passive element is electrically connected to at least either of the first and second wiring layers and is disposed on the chip 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
