| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method which can be easily implemented and by which excellent package is simultaneously attained for encapsulating an electronic arrangement against permeants, especially vapor and oxygen. <P>SOLUTION: The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated. <P>COPYRIGHT: (C)2010,JPO&INPIT |
