METHOD OF FORMING METALLIC STRUCTURE AND METALLIC STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a metallic structure by which a bump having a micron order surface area is stably formed by an electroplating method.

SOLUTION: The method of forming the metallic structure includes: a mask film forming step of forming a plating mask film 3 having a plurality of opening parts 3A each having a micron order surface area on the surface of the substrate 1 wherein total surface area of all opening parts 3A is≤0.01% of the surface area of a substrate 1; an external electrode forming step of forming an external electrode 6 having a surface area of≥3,000 times of total surface area of the opening parts 3A in an outer peripheral part of the substrate 1; and an electroplating step of film-forming the bump by the electroplating method using the opening parts 3A of the substrate 1 and the external electrode as a cathode.

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