发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a structure capable of improving productivity even when conveying a large number of substrates to be processed. Ž<P>SOLUTION: The substrate processing apparatus includes: a conveyance chamber 50 which is moved along a prescribed movement route 55 to convey a first cassette 54 wherein a plurality of processing object substrates 12 can be stored; a plurality of processing chambers 16 which are disposed around the moving route 55 of the conveyance chamber 50 and process the processing object substrates 12; a buffer chamber 42 which is disposed between the processing chambers 16 and the conveyance chamber 50 and has a second chamber 43 wherein the plurality of processing object substrates 12 can be stored; and a cassette placing part 47 capable of temporarily placing the first cassette 54 between the buffer chamber 42 and the conveyance chamber 50. When processing object substrates 12 are delivered one by one by a substrate delivery robot 44 provided between the first cassette 54 temporarily placed in the cassette placing part 47 from the conveyance chamber 50 and the second cassette 43 disposed in the buffer chamber 42, an inert gas or vacuum atmosphere is produced in the apparatus. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010067878(A) 申请公布日期 2010.03.25
申请号 JP20080234384 申请日期 2008.09.12
申请人 SEIKO EPSON CORP 发明人 MIYAZAWA HIDEAKI
分类号 H01L21/677;H01L21/027 主分类号 H01L21/677
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