发明名称 |
MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE |
摘要 |
A manufacturing method for a semiconductor device, including: loading a wafer into a reaction chamber; placing the wafer on a push-up shaft moved up; preheating the wafer under controlling an in-plane temperature distribution of the wafer to be a recess state under a state of placing the wafer on the push-up shaft moved up; lowering the push-up shaft with the wafer kept in the recess state to hold the wafer on a wafer holding member; heating the wafer to a predetermined temperature; rotating the wafer; and supplying a process gas onto the wafer.
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申请公布号 |
US2010075509(A1) |
申请公布日期 |
2010.03.25 |
申请号 |
US20090563602 |
申请日期 |
2009.09.21 |
申请人 |
HIRATA HIRONOBU;YAJIMA MASAYOSHI;MORIYAMA YOSHIKAZU |
发明人 |
HIRATA HIRONOBU;YAJIMA MASAYOSHI;MORIYAMA YOSHIKAZU |
分类号 |
H01L21/316;B05C11/00 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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