| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component for suppressing failures, such as disconnection or the like caused by thermal stress at a connection part that is often generated in a conventional solder bump connection, in a connection between a semiconductor package which mounts a semiconductor chip and a wiring substrate, and of enhancing connection reliability of the connection part that electrically connects between electrodes of a connection surface. <P>SOLUTION: In a connection between a semiconductor package 3 on which a semiconductor chip 3-1 is mounted and a wiring substrate, the connection part includes a stress relaxation part 5 in which a plastic body material layer and a metal layer are alternately laminated without using a solder bump, and a conductor line 6 penetrating the stress relaxation part. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
