发明名称 GRAPHICS CARD THERMAL INTERPOSER
摘要 A thermal interposer component (200) for a liquid cooling system configured for use with an electronic component (10) such as personal computer adapter card, and in particular, for a graphics display card. The thermal interposer component (200) consists of a planar body (202, 204) of a thermally conductive material, configured for attachment to the electronic component (10), in thermal contact on one face (206) with multiple heat sources on the electronic component (10), including at least one processor. A plurality of heat pipes (208) are seated within recessed channels (210) within the planar body (202, 204) to facilitate a transfer of thermal energy absorbed by the planar body (202, 204) from the heat sources. A modular cold plate assembly (100) coupled to a liquid cooling system is removably coupled to the planar body (202, 204) in a thermal transfer region or socket (212) opposite from the multiple heat sources, to drawn heat from the planar body, the heat pipes, and from the at least one processor via a circulating liquid coolant.
申请公布号 WO2009143330(A3) 申请公布日期 2010.02.25
申请号 WO2009US44813 申请日期 2009.05.21
申请人 ASETEK A/S;ALYASER, MONEM, H.;RICE, JEREMY, A. 发明人 ALYASER, MONEM, H.;RICE, JEREMY, A.
分类号 G06F1/20;G06F1/16;H05K7/20 主分类号 G06F1/20
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