| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroplating method and an electroplating apparatus for uniformly forming a plated film on the surface of a material to be plated. Ž<P>SOLUTION: The electroplating method includes plating and forming the plated film on the surface of the material 12 to be plated using the electroplating apparatus comprising a plating bath 2, and an anode plate 3 and a cathode plate 7 provided in the plating bath 2. In the method, the plated film is formed on the surface of the material 12 by supplying current between both electrodes while rotating a rotary part 8 in such a state that the material 12 is held between the cathode plate 7 and the rotary part 8 in a plating liquid 20. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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