| 摘要 |
A remote sensor assembly includes a silicon substrate, a plurality of microelectromechanical system (MEMS) sensors supported on the silicon substrate, a wireless communication circuit supported on the silicon substrate, and a processing device supported on the silicon substrate. The processing device is operable to obtain measurement values from at least one of plurality of MEMS sensors, perform a first filtering operation on the measurement values, and determine whether to cause the communication circuit to transmit a signal to an external device based on the first filtering operation.
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