发明名称 SPECTROSCOPIC MODULE
摘要 Since a spectroscopic module (1) has a plate-shaped body section (2), the spectroscopic module can be reduced in size by reducing the thickness of the body section (2). Moreover, since the body section (2) is plate-shaped, the spectroscopic module (1) can be manufactured, for example, by using a wafer process. More specifically, by providing lens sections (3), diffraction layers (4), reflection layers (6) and light detecting elements (7) in a matrix form on a glass wafer which becomes many body sections (2) and dicing the glass wafer, many spectroscopic modules (1) can be manufactured. This enables easy mass production of spectroscopic modules (1).
申请公布号 KR20100017079(A) 申请公布日期 2010.02.16
申请号 KR20097000422 申请日期 2008.06.05
申请人 HAMAMATSU PHOTONICS K.K. 发明人 SHIBAYAMA KATSUMI;TEICHMANN HELMUT;YOKINO TAKAFUMI;SUZUKI TOMOFUMI;HILLER DIETMAR;STARKER ULRICH
分类号 G01J3/02 主分类号 G01J3/02
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