| 发明名称 |
RDL PATTERNING WITH PACKAGE ON PACKAGE SYSTEM |
| 摘要 |
An integrated circuit package system includes: providing an internal device; encapsulating the internal device with an encapsulation having an outer surface; and forming a redistribution line having connection points on the outer surface of the encapsulation.
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| 申请公布号 |
US2010025833(A1) |
申请公布日期 |
2010.02.04 |
| 申请号 |
US20080182132 |
申请日期 |
2008.07.30 |
| 申请人 |
PAGAILA REZA ARGENTY;DO BYUNG TAI;MERILO DIOSCORO A |
发明人 |
PAGAILA REZA ARGENTY;DO BYUNG TAI;MERILO DIOSCORO A. |
| 分类号 |
H01L23/488;H01L21/56 |
主分类号 |
H01L23/488 |
| 代理机构 |
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代理人 |
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| 主权项 |
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