| 摘要 |
PURPOSE: A sputter target assembly with low temperature and high-strength bond is provided to weld target material on a backing plate at low temperature through soldering. CONSTITUTION: A sputter target assembly with low temperature and high-strength bond comprises a backing plate(11), a sputter target(4), and a foil layer(6). The backing plate has an exposed surface. The sputter target has an exposed surface. The foil layer is applied on the exposed surfaces of the backing plate and the sputter target. The application of the foil layer is formed at the low temperature. An ignitable coupling foil layer is interposed between the solder material of the backing plate and the solder material of the target material.
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