CHIP MOUNTER AND METHOD FOR RECOGNIZING BGA PACKAGE THEREOF

摘要

PURPOSE: A chip mounter and a BGA(Ball Grid Array) package recognition method thereof are provided to automatically read and store information about electronic components composed of a BGA package. CONSTITUTION: A chip mounter comprises an image acquisition part, a pattern recognition part, and a storage part. A BGA package recognition method of the chip mounter comprises a seed selection step(200) for selecting a seed among a plurality of solder balls of a BGA package, and a grouping step for making the solder balls which are adjacent to the seed and have the same pattern as the seed into the same group as the seed.