| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To securely fix a package body and a lid body of a semiconductor device like a microphone package without any gap with simple structure. <P>SOLUTION: A package for the semiconductor includes the package body 7 formed by embedding at least part of a lead frame in a mold resin body 6, and the lid body 8 made of a conductive material fixed to a peripheral edge of the package body 7 in a state wherein a top of a semiconductor chip 2 mounted on the package body 7 is provided. A conductive portion where a part of a stage portion 11 of the lead frame is exposed and a resin portion made of a part of the mold resin body 6 are arranged at the peripheral edge of the package body 7, the lid body 8 is provided with a connection portion brought into contact with the conductive portion in an electric connection state, and a fixation reinforcing means is provided in a fixation portion between those package body 7 and lid body 8, obtained by roughening a surface of the resin portion. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
