发明名称 |
Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel |
摘要 |
An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
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申请公布号 |
US7633752(B2) |
申请公布日期 |
2009.12.15 |
申请号 |
US20040811597 |
申请日期 |
2004.03.29 |
申请人 |
INTEL CORPORATION |
发明人 |
PRASHER RAVI |
分类号 |
H05K7/20;H01L23/38;H01L23/473 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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