| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable semiconductor device by improving heat radiation efficiency. SOLUTION: The semiconductor device includes: a first laminate including a first heat sink, a first insulating layer, a first conductive layer, and a first semiconductor element in this order; a second laminate including a second heat sink, a second insulating layer, a second conductive layer, and a second semiconductor element formed by a semiconductor material differing from the first semiconductor in this order; and a connection section for connecting the first conductive layer to the second one electrically. The first laminate is thermally insulated from the second one. COPYRIGHT: (C)2010,JPO&INPIT |
