| 摘要 |
A light emitting module (12) is provided with a circuit board (20), a plurality of LED chips (21) mounted on a surface of the circuit board (20), and a plurality of lenses (30) covering the LED chips (21). The circuit board (20) is provided with a plurality of portions defining gate holes (27), which penetrate the circuit board from a front surface to a rear surface, and a runner (26), which is formed to pass on the portions defining the gate holes (27) on the rear surface side of the circuit board (20). The plurality of lenses (30) are formed on the front surface of the circuit board (20) by injection-molding a resin for the lens through the runner (26) and the portions defining the gate holes (27). Connecting sections (31) each integrated with corresponding one of the lenses (30) are formed in the portions defining the gate holes (27), and a supporting section (32) integrated with the connecting sections (31) is formed in the runner (26). At this time, a height of the supporting section (32) formed in the runner (26) is set at a height of the rear surface of the circuit board (20) or lower. Thus, mechanical stability of a cover member and the like arranged corresponding to a solid-state light emitting element is improved.
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