ADHESIVETAPE AND MANUFACTURE METHOD FOR PRODUCING QUAD-FLAT NON-LEAD SEMICONDUCTOR DEVICES

摘要

A method for preparing a polyimide silicone adhesive tape for producing a QFN(Quad-Flat Non-lead) semiconductor package is provided to minimize the thickness of an adhesive layer, to prevent dropping of an epoxy resin and separation or lift-up from a lead frame, and to leave no residue after removal. A method for preparing a polyimide silicone adhesive tape attached to the bottom of a lead frame of a QFN(Quad-Flat Non-lead) semiconductor package to prevent dropping of an epoxy resin injected to the top of the lead frame, comprises the steps of: (i) treating a primer(200) for silicone on the top of a polyimide film(100); (ii) stacking a silicone adhesive layer(300) on the top of the polyimide film treated with a primer for silicone; and (iii) attaching a fluorine-containing release agent-treated polyethylene terephthalate film(400) on the top of the silicone adhesive layer.