| 发明名称 |
DUAL-SIDED DIE PACKAGES |
| 摘要 |
An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate. |
| 申请公布号 |
US2016211190(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201314914998 |
申请日期 |
2013.09.27 |
| 申请人 |
INTEL CORPORATION |
发明人 |
BRAUNISCH Henning;EID Feras;ELSHERBINI Adel A.;SWAN Johanna M.;NELSON Don W. |
| 分类号 |
H01L23/367;H01L21/52;H01L23/498 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device assembly apparatus comprising:
a die comprising a first side and an opposite second side, the first side comprising a first type of system level contact points and the second side comprising a second type of system level contact points; and a package substrate coupled to one of the first side of the die and the second side of the die. |
| 地址 |
Santa Clara CA US |
