发明名称 Electro-fluidic interconnect attachment
摘要 An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.
申请公布号 US7607223(B2) 申请公布日期 2009.10.27
申请号 US20070834797 申请日期 2007.08.07
申请人 HARRIS CORPORATION 发明人 PLESKACH MIHAEL;KOENEMAN PAUL;GAMLEN CAROL;SNYDER STEVEN R.
分类号 H05K3/02 主分类号 H05K3/02
代理机构 代理人
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