| 摘要 |
<p>PURPOSE: A method of producing a wired circuit board is provided to prevent extraction of conductive materials with narrow width, thereby improving adhesion features between a section conductive layer and a base insulating layer. CONSTITUTION: A base insulating layer(3) is formed on a metal support layer(2). A conductive thin film(8) is formed on the base insulating layer. A conductor pattern(4) is formed on the conductive thin film. A cover insulating layer(5) is formed on the base insulating layer. The metal support layer is a reinforcing layer.</p> |
