| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of achieving excellent compatibility when forming a dry film and excellent resolution and close adhesion property, showing equal sensitivity when exposed to light of exposure machines of both types of i-line and h-line, and developing by an alkaline aqueous solution without generating condensate during development. <P>SOLUTION: This photosensitive resin composition contains (a) a resin for binder of 20-90 wt.% having carboxyl group content of 100-600 by acid equivalent, containing a specific compound as a copolymer component, and having an average molecular weight of 5,000-500,000, (b) an addition polymerizable monomer of 5-75 wt.% having at least one terminal ethylenic unsaturated group, (c) a photopolymerization initiator of 0.01-30 wt.% containing triarylimidazolyl dimer, and (d) a specific pyrazoline compound of 0.001-10 wt.%. <P>COPYRIGHT: (C)2010,JPO&INPIT |
