| 摘要 |
<p>PURPOSE: A power semiconductor module including a circuit arranging body of a sealing state is provided to have a flexible structure related to simple productivity. CONSTITUTION: A power semiconductor module including a circuit arranging body of a sealing state includes a base material(2). A circuit arranging body is formed on a top surface of the base material. The base material includes a plurality of conductor tracks(22). A power semiconductor part(3) connected to a circuit by a connecting device(4) is arranged on the base material. At least two conductive layers(40,42) and at least one insulation layer(44) are alternately laminated. The base material has a first sealing part(200) which surrounds the circuit arranging body.</p> |
