| 发明名称 |
Process For The Electrolytic Treatment Of A Component, And A Component With Through-Hole |
| 摘要 |
There is described a method wherein through holes of a wall are treated on a inside, and wherein one respective pole electrode is assigned to each through hole that is to be processed.
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| 申请公布号 |
US2009208344(A1) |
申请公布日期 |
2009.08.20 |
| 申请号 |
US20050667332 |
申请日期 |
2005.09.16 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
JABADO RENE;KADEN UWE;KRUEGER URSUS;KOERTVELYESSY DANIEL;REICHE RALPH;RINDLER MICHAEL;STEINBACH JAN;TIEMANN PETER;OLTMANNS IRIS |
| 分类号 |
F01D5/18;C25D5/02;C25D21/12 |
主分类号 |
F01D5/18 |
| 代理机构 |
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