| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus of polishing a crystal wafer, preventing a damaged layer from remaining at an edge of the wafer, and improving productivity without degradation. <P>SOLUTION: The crystal wafer polishing apparatus 10 comprises: a holding means 11 for holding a wafer laminate 1 by pinching, in a pressurized state, both end surfaces of the wafer laminate 1 formed of a plurality of crystal wafers S laminated in the thickness direction via moisture without via an adhesive; a polishing brush 12 provided on a side of the laminate 1 for polishing a side face of the wafer laminate 1; a brush rotating means 13 for rotating the polishing brush 12 in a planar direction of front and rear faces of each crystal wafer S constituting the laminate 1; and a moving means 14 for moving the brush 12 in the lamination direction of each crystal wafer S constituting the laminate 1. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
