发明名称 Method of manufacturing for conductive pattern substrate
摘要 In the present invention, the problem of stability deterioration of the obtained conductive pattern substrate at the time of forming a conductive pattern by an additive method when a layer having reactivity remains on the substrate is to be solved. According to pattern exposure with a photo catalyst substrate 4 having a photo catalyst layer 3 laminated on a second substrate 5 superimposed onto a wettability changeable substrate 1 with a wettability changeable layer 3 laminated on a first substrate 2, a wettability pattern is formed. And furthermore, by adhering a conductive coating solution, or the like, a conductive pattern substrate without containing a photo catalyst can be manufactured.
申请公布号 US7569334(B2) 申请公布日期 2009.08.04
申请号 US20030417516 申请日期 2003.04.17
申请人 DAI NIPPON PRINTING CO., LTD. 发明人 KOBAYASHI HIRONORI;YAMASHITA YUDAI
分类号 G02F1/1343;G03F7/16;B01J35/02;G02F1/1345;G03F7/00;G03F7/075;G03F7/09;G03F7/20;G03F7/26;H01B13/00;H05K3/04;H05K3/10;H05K3/12 主分类号 G02F1/1343
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