发明名称 |
Method of manufacturing for conductive pattern substrate |
摘要 |
In the present invention, the problem of stability deterioration of the obtained conductive pattern substrate at the time of forming a conductive pattern by an additive method when a layer having reactivity remains on the substrate is to be solved. According to pattern exposure with a photo catalyst substrate 4 having a photo catalyst layer 3 laminated on a second substrate 5 superimposed onto a wettability changeable substrate 1 with a wettability changeable layer 3 laminated on a first substrate 2, a wettability pattern is formed. And furthermore, by adhering a conductive coating solution, or the like, a conductive pattern substrate without containing a photo catalyst can be manufactured.
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申请公布号 |
US7569334(B2) |
申请公布日期 |
2009.08.04 |
申请号 |
US20030417516 |
申请日期 |
2003.04.17 |
申请人 |
DAI NIPPON PRINTING CO., LTD. |
发明人 |
KOBAYASHI HIRONORI;YAMASHITA YUDAI |
分类号 |
G02F1/1343;G03F7/16;B01J35/02;G02F1/1345;G03F7/00;G03F7/075;G03F7/09;G03F7/20;G03F7/26;H01B13/00;H05K3/04;H05K3/10;H05K3/12 |
主分类号 |
G02F1/1343 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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