发明名称 CONDUCTIVE CONNECTION MATERIAL AND METHOD OF MANUFACTURING MODULE
摘要 PROBLEM TO BE SOLVED: To provide a conductive connection material capable of reducing variation in thickness of a solder member by reducing temperature differences in an electrode for connection, and to provide a manufacturing method of a module using the same. SOLUTION: The conductive connecting material made of the annular solder member has a cut 3 made in its outer peripheral portion. Through the cut 3, a range from the conductive connection material 10 to the conductor for connection of a substrate as an object of connection by the solder member 1 can be irradiated with laser light so that a range of the conductor for connection which is close to the center of the conductive connecting material 10 can be heated efficiently, and the temperature differences in a formation region of the electrode for connection are reduced to reduce variance in thickness of the solder member 1, after soldering. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009158521(A) 申请公布日期 2009.07.16
申请号 JP20070331628 申请日期 2007.12.25
申请人 KYOCERA CORP 发明人 WADA KOJI
分类号 H05K3/34;B23K1/00;B23K1/005;B23K35/14;B23K35/26;B23K101/42 主分类号 H05K3/34
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