发明名称 Mg-BASED SOLDER ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a new high-melting point leadless solder alloy the melting starting point (liquidus temperature) of which is≥280°C and the melting starting temperature (solidus temperature) of which is≤350°C. SOLUTION: The Mg-based solder alloy contains, by mass, 0 to 8% Al, 37 to 45% Zn and 0.5 to 3% Ga, and the balance Mg with inevitable impurities. Since the Mg-based solder alloy has a melting point (liquidus temperature) of≥280°C and a melting starting temperature (solidus temperature) of≤350°C, it can be preferably used as leadless solder having a high melting point instead of Sn-95Pb. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009142849(A) 申请公布日期 2009.07.02
申请号 JP20070321889 申请日期 2007.12.13
申请人 MITSUI MINING & SMELTING CO LTD 发明人 MIYAKE KOICHI;HASEGAWA ATSUSHI;SHIMAMURA HIROYUKI
分类号 B23K35/28;C22C23/04;H05K3/34 主分类号 B23K35/28
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