METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for producing semiconductor device exposing a planarized upper portion of a projected electrode from the surface of a sealing resin without cutting an upper portion of the sealing resin. SOLUTION: In a status of an upper portion of a projected electrode 4 pressed to an inner surface of a cavity 8 of a metal mold 7 to clamp it, a resin is poured into the cavity 8 to seal the main surface of the substrate 1 and planarize the upper portion of the projected electrode 4 exposed from the surface of the sealing resin in the same plane of the resin surface. COPYRIGHT: (C)2009,JPO&INPIT