| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device having high pickup accuracy of a semiconductor chip by suppressing the disturbance of alignment of a semiconductor chip after dicing, even if a dicing tape having a rigid layer is used. SOLUTION: The manufacturing method of semiconductor devices has a first process for applying a semiconductor wafer 16 onto an adhesive layer of the dicing tape 12, where a base material layer, a rigid layer, and an adhesive layer are laminated successively; a second process for performing dicing so that a groove is formed in the rigid layer; and a third process for separating the semiconductor chip 10 from the adhesive layer, by applying a load from a side opposite to a side, having the semiconductor wafer 16 of the base material layer. In the manufacturing method of semiconductor devices, at least one of dicing lines formed in the second process is positioned, at a region to which semiconductor wafers 16 are not stuck. COPYRIGHT: (C)2009,JPO&INPIT
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