发明名称 Film Profile Forming Method
摘要 A film thermoforming method includes inserting a film prefabricated material need to be thermoformed into a lower die of a thermoforming device. The thermoforming device includes an upper die movable to-and-fro opposite to the lower die based on the shape of a film product. The upper die moves downwards gradually to press from a predetermined manufacturing height and then moves upwards to release the prefabricated material by a cycle mode, and the method decreases gradually the manufacturing height of the upper die for thermoforming the film product in a predetermined time. The present method can improve the precision and the quality of the film product, and can decrease largely the manufacturing time.
申请公布号 US2009146343(A1) 申请公布日期 2009.06.11
申请号 US20080968697 申请日期 2008.01.03
申请人 WEN YI 发明人 WEN YI
分类号 B29C51/08 主分类号 B29C51/08
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