发明名称 |
HEAT-RESISTANT POLYIMIDE RESIN, AND SEAMLESS TUBULAR BODY, COATED FILM, COATED PLATE AND HEAT-RESISTANT COATING MATERIAL, USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant polyimide resin from which a coated film and a seamless tubular body, which are excellent in tensile modulus and tensile elongation, can be formed. SOLUTION: The heat-resistant polyimide resin is the one obtained by allowing an aromatic diamine to react with an aromatic tetracarboxylic acid dianhydride, wherein the aromatic diamine contains para-phenylene diamine and 3,4'-diamino diphenylether respectively by 10 mol% or more on the basis of the total amount of the aromatic diamine, the tensile modulus of the coated film at 23°C made of the polyimide resin is 4.5 GPa or more and the tensile elongation thereof at 23°C is 60% or more. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009120796(A) |
申请公布日期 |
2009.06.04 |
申请号 |
JP20080003377 |
申请日期 |
2008.01.10 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
YOTSUYA SEIICHI;SAITO YASUYUKI |
分类号 |
C08G73/10;B05D7/24;C09D179/08 |
主分类号 |
C08G73/10 |
代理机构 |
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