发明名称 HEAT-RESISTANT POLYIMIDE RESIN, AND SEAMLESS TUBULAR BODY, COATED FILM, COATED PLATE AND HEAT-RESISTANT COATING MATERIAL, USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a heat-resistant polyimide resin from which a coated film and a seamless tubular body, which are excellent in tensile modulus and tensile elongation, can be formed. SOLUTION: The heat-resistant polyimide resin is the one obtained by allowing an aromatic diamine to react with an aromatic tetracarboxylic acid dianhydride, wherein the aromatic diamine contains para-phenylene diamine and 3,4'-diamino diphenylether respectively by 10 mol% or more on the basis of the total amount of the aromatic diamine, the tensile modulus of the coated film at 23°C made of the polyimide resin is 4.5 GPa or more and the tensile elongation thereof at 23°C is 60% or more. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009120796(A) 申请公布日期 2009.06.04
申请号 JP20080003377 申请日期 2008.01.10
申请人 HITACHI CHEM CO LTD 发明人 YOTSUYA SEIICHI;SAITO YASUYUKI
分类号 C08G73/10;B05D7/24;C09D179/08 主分类号 C08G73/10
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