| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing process without needing to separate a metal pressing plate directly from a pressure-fit sheet layer in a heat laminating-pressing process in a non-contact IC label manufacturing process and to provide a non-contact IC label manufacturing process with less intervention of manual operation. <P>SOLUTION: A non-contact IC card manufacturing method includes processes of: temporarily lining an inlet base material with an IC tag or an antenna laid, from the outside with a plurality of core base materials to form a laminate; holding the laminate by a pair of mould releasing films; holding the laminate from the top of the mould releasing films by a pair of metal plates; heat-pressing the metal plates; separating the metal plates, the mould releasing films and the integrated laminate; and cutting the integrated laminate to segment it. <P>COPYRIGHT: (C)2009,JPO&INPIT |
