发明名称 CONDUCTIVE PASTE AND PRINTED CIRCUIT BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste capable of improving an electrical conductivity, and to provide a printed circuit board using the same. SOLUTION: The conductive paste contains conductive particles and carbon nanotubes. The surface of the carbon nanotube may be coated with metal particles. The metal particles for coating the carbon nanotube can be selected from a group of silver, cooper, tin, indium, palladium, and their mixture. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009117340(A) 申请公布日期 2009.05.28
申请号 JP20080186123 申请日期 2008.07.17
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD;SUNGKYUNKWAN UNIV FOUNDATION FOR CORPORATE COLLABORATION 发明人 LEE EUNG-SUEK;BAIK SEUNG-HYUN;KIM YOUNG-JIN;OH YOUNG-SEOK;CHOI JAE-BOONG;SUH DAE-WOO;YOO JE-GWANG;RYU CHANG-SUP;HWANG JUN-OH;MOK JEE-SOO
分类号 H01B1/22;H05K3/12 主分类号 H01B1/22
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