| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, a mother board and an electronic device, wherein it is possible to improve joint strength between a land and a substrate and between the land and a contact member, and reliability against a shock is superior to a conventional case. <P>SOLUTION: A land 9 provided with convex portions/concave portions arranged so as to comprise finite rotation symmetry is provided on a substrate 13 of the wiring board 1, the side surface and the vicinity of the outer periphery of the top surface of the land 9 are partially covered with solder resist 21b, and the solder resist 21b comprises a contact portion that is in contact with the land 9 and a non-contact portion that is not in contact with the land 9. The non-contact portion is formed of a notched part and forms an NSMD structure wherein the land 9 and the solder resist 21b are not in contact. The NSMD structure is provided radially from the center of the land 9 to the outer periphery. On the other hand, the contact portion of the solder resist 21b forms an SMD structure wherein it is in contact with the land 9. That is, the wiring board 1 has both of the NSMD structure and the SMD structure. <P>COPYRIGHT: (C)2009,JPO&INPIT |
