发明名称 PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To improve plasma processing by efficiently removing undesirable deposits adhering to a DC ground electrode used in a DC voltage application method by means of a simple configuration to maintain a good DC ground function. <P>SOLUTION: In a plasma etching apparatus, a first high frequency for plasma generation and a second high frequency for ion attraction are applied from high frequency power sources 32 and 34 to a susceptor 12, respectively. Further, a DC voltage is applied from a variable DC power source 78 to an upper electrode 64 via a filter circuit 76. An annular DC ground part (DC ground electrode) 52 attached to an upper side surface of the susceptor 12 is connected to a filter circuit 54. This filter circuit 54 selectively allows a specific frequency component of intermodulation distortion generated in a plasma to flow to a ground line through a series resonant circuit. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009099858(A) 申请公布日期 2009.05.07
申请号 JP20070271562 申请日期 2007.10.18
申请人 TOKYO ELECTRON LTD 发明人 IWATA MANABU
分类号 H01L21/3065;H01L21/205;H05H1/46 主分类号 H01L21/3065
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