发明名称 LOW-BOILING COMPOUND-INCLUDING HOLLOW FINE PARTICLES
摘要 PROBLEM TO BE SOLVED: To provide hollow fine particles in which the release of a substance contained in hollow fine particles can be controlled by the operation from the outside. SOLUTION: The hollow fine particles have an average particle diameter of≥50 nm and≤100μm and have hollow shells having liquid-permeable fine through-holes and a water-insoluble low-boiling compound that is enclosed in the hollow shell and has a boiling point of≥40°C and≤100°C. The hollow fine particles are cooled in a solution to the boiling point of the low-boiling compound or below, the low-boiling compound is liquefied and the pressure in the hollow fine particles is reduced to take the solution in the hollow fine particles. The hollow fine particles are heated to the boiling point of the low-boiling compound or above, so that the low-boiling compound is vaporized and the pressure in the hollow fine particles is increased, to release an aqueous solution in the hollow fine particles to the outside of the hollow fine particles. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009067684(A) 申请公布日期 2009.04.02
申请号 JP20070234572 申请日期 2007.09.10
申请人 TOKYO INSTITUTE OF TECHNOLOGY 发明人 ABE MASANORI;NAKAGAWA TAKASHI;TADA MASARU;HANDA HIROSHI;KANAMARU SHUN
分类号 A61K9/51;A61K47/02;A61K47/04;G01K11/22 主分类号 A61K9/51
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