发明名称 |
Curable resin composition |
摘要 |
A resin composition having a viscosity suitable for encapsulating optical devices such as light-emitting devices is provided. Specifically, the cured product of the resin composition has a refractive index greater than or equal to that of epoxy resins, exhibits excellent heat resistance and light resistance, and has thermal stress relaxation properties. The curable resin composition contains a fluorene group-containing acrylate or methacrylate represented by the following formula and a specific monofunctional acrylate or methacrylate:
wherein X is -(CH 2 CH 2 O) n - or -(CH 2 CH 2 O) n -CH 2 CH(OH)CH 2 O- with n being 1 to 5 and R is an acrylic or methacrylic group.
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申请公布号 |
EP2042528(A1) |
申请公布日期 |
2009.04.01 |
申请号 |
EP20070018843 |
申请日期 |
2007.09.25 |
申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORPORATION |
发明人 |
SAMUKAWA, HIROSHI;HATSUDA, KOUKI;IKEDA, YOSHITO;ANDO, HISASHI;YAMAMOTO, NORIKAZU |
分类号 |
C08F222/20;C08F220/30;G02B1/10;H01L33/56 |
主分类号 |
C08F222/20 |
代理机构 |
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