| 摘要 |
<P>PROBLEM TO BE SOLVED: To form wiring with a single layer of a conductor part to contribute to cost reduction. <P>SOLUTION: Insulating layers 13 and 14 having openings from which electrode pads 12b and 12c of a device are exposed are formed on a surface of a semiconductor substrate 11 having the device fabricated therein, and a pad 17 for an external terminal defined by a portion of a conductor layer formed on the insulating layer is connected to the respective electrode pads 12b and 12c through bonding wires 18 and 19. Further, a conductor post 20 is formed on the pad 17 for an external terminal, and an encapsulation resin layer 22 is formed to coat a region on the semiconductor substrate 11 in which the conductor post is formed, and to expose a top portion of the conductor post 20. An external connecting terminal 23 is bonded to the top portion of the conductor post 20. <P>COPYRIGHT: (C)2009,JPO&INPIT |
