发明名称 Semiconductor memory devices having contact pads with silicide caps thereon
摘要 An integrated circuit device having a semiconductor substrate includes a gate structure on the semiconductor substrate. Source/drain regions are on opposite sides of the gate structure. A contact pad is on at least one of the source/drain region, and a silicide cap is on a surface of the contact pad opposite the respective source/drain region.
申请公布号 US7501668(B2) 申请公布日期 2009.03.10
申请号 US20060582926 申请日期 2006.10.18
申请人 SAMUNG ELECTRONICS CO., LTD. 发明人 JANG SE-MYEONG;OH YONG-CHUL;JIN GYO-YOUNG
分类号 H01L27/088;H01L27/10;H01L21/768;H01L21/8242;H01L23/485;H01L27/105;H01L27/108;H01L29/78 主分类号 H01L27/088
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