CONDUCTIVE PASTE AND MANUFACTURING METHOD, THEREOF WIRING AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS USING THEM

摘要

PROBLEM TO BE SOLVED: To provide conductive paste capable of forming a wiring having high conductivity by heat treatment at low temperatures without using a binder, the wiring which can be obtained by curing the paint film of the conductive paste, and to provide an electronic component and an electronic apparatus using the wiring obtained in this way. SOLUTION: Conductive fine particles 21 the surfaces of which are coated with a coat 23 formed with a film compound having a reactive group, and a curing agent 12 having a plurality of cross-linking reaction groups forming a bond by reacting with the reactive group are mixed with a solvent, and the conductive paste is thereby obtained. The conductive paste is applied to the surface of a base material 31 the surface of which is coated with a coat 33 formed by a second film compound having a second reactive group to obtain an electrode wire 10 cured by cross-linking reaction of the reactive group and the second reactive group with the cross-linking reaction group. COPYRIGHT: (C)2009,JPO&INPIT