| 摘要 |
<p>A semiconductor package (10) includes a base plate (12) having first and second surfaces (12a and 12b) both facing in opposite directions, and a plurality of anisotropic heat conducting members (22) disposed in the base plate and spaced away from each other. A semiconductor element (14) having a heat generating unit (14a) is mounted on the first surface, and the second surface is supported on a supporting member having a thermal conductivity. Each anisotropic heat conducting member has a sheet shape intersecting with the first and second surfaces, and orientates a direction of higher thermal conductivity than the thermal conductivity of the base plate in a direction from the first surface toward the second surface.</p> |
