发明名称 |
Process for producing semiconductor device |
摘要 |
A process for semiconductor device production by which the reliability of connection with bumps can be easily heightened with higher certainty. The process for producing a semiconductor device comprising a substrate having bumps formed thereon, comprises covering the bumps with an adhesive film which has a modulus of elasticity (-55° C.) of from 100 MPa to 5 GPa and has a thickness corresponding to from 5 to 40% of the height of the bumps, and then disposing the adhesive film on the substrate so that the bumps pierce through the adhesive film and come to protrude therefrom.
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申请公布号 |
US7487586(B2) |
申请公布日期 |
2009.02.10 |
申请号 |
US20030737853 |
申请日期 |
2003.12.18 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
MATSUMURA AKIKO;HOTTA YUJI |
分类号 |
H01L21/60;H05K3/30;H01L21/48;H01L23/498;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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