METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND EXPOSURE APPARATUS

摘要

Disclosed is a method for manufacturing a semiconductor device, which makes processing on a semiconductor layer easier while providing a planarization layer. Also disclosed are a semiconductor device suitably manufactured by such a method, and an exposure apparatus suitably used in such a method. Specifically disclosed is a method for manufacturing a semiconductor device which has, on a substrate, a semiconductor layer and a planarization layer having a shape surrounding the semiconductor layer when the substrate is viewed in plan. This method for manufacturing a semiconductor device is characterized by comprising a step for forming a semiconductor layer on a substrate, a step for forming, on the semiconductor layer, a photosensitive organic film having a photosensitive wavelength range overlapping the light absorption wavelength range of the semiconductor layer, and a step for forming a planarization layer by exposing the photosensitive organic film with light in the photosensitive wavelength range from the substrate side and developing the photosensitive organic film.